Jobs / United States / Intel Corporation

Memory Circuit Design Engineer

Intel Corporation · 🇺🇸 4 Locations

Sponsorship verdict

Sponsorship possible

One solid signal, not two — worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
  • What Intel Corporation paid sponsored hires in similar roles211 certified filings for “Component Design Engineer” (Electronics Engineers, Except Computer) in CA: $125k–$167k, median $142k. Most were filed at wage level III (43%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
  • Confirmed live todayWhen a source last listed this job as open.

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.

Start free →

Or apply yourself on the official page →

Sponsor Radar — Intel Corporation

1,731 H-1B filings certified since Oct 2025

The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).

Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →

About the role

Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. The Advanced Design (AD) team is part of Intel's larger Design Technology Platform (DTP) Organization and is focused on pathfinding and development of advanced memory technology. These circuits enable best-in-class memory collateral, IP and innovative product design across all generations of Intel process technology. At Intel, DTP is one of the key pillars enabling Intel to deliver winning products in the marketplace. Your work will directly enable Intel's internal and external customers to get to the market faster with products that include high-performance, high-density, low-power memory at the leading edge of the technology curve and implemented in Intel's advanced CMOS process technologies. You will be partnering with and leveraging domain experts across various areas of technology development, EDA vendors and product design teams to develop and deliver high-quality industry-leading memory technology collaterals and to drive circuit innovations that enable next generation high-performance, high-density, low-power embedded memory designs on Intel advanced CMOS process technologies. In this position your responsibilities will include, but may not be limited to: • Memory pathfinding activities and power, performance and area (PPA) optimization through design technology co-optimization (DTCO) and product design enablement. • Memory bit-cell and complex periphery IC layout and automation. • Memory array/IP design, memory circuit innovation, test-chip design. • Pre-Si verification, post-Si validation and debugging to enable yield and parametric tracking/ramp. Qualifications: You must possess the minimum qualifications listed below to interview for this position. Preferred qualifications are not required but may work to your advantage during the interview process. Minimum Qualifications: Master degree in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering, or a related discipline, including 4+ years of professional experience gained through either internships or full-time employment Or a PhD in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering, or a related discipline. Technical Experience: • Design, characterization, and verification of custom memory circuits such as SRAM, Register Files or ROM. • Design trade-offs between power, performance, and area (PPA). • Custom digital circuit design, simulation, layout design, and verification. • Knowledge of EDA tools used for custom digital and memory circuit design. Preferred Qualifications: • PhD with 1-2 years of professional experience gained through either internships or full-time employment. • Design technology co-optimization (DTCO). • Post-Si validation experience. • Knowledge of the CMOS ASIC design flow.            Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix, US, California, Santa Clara, US, Texas, Austin Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed

View the official posting →

Source: Employer career site (Workday) First seen: 2026-10-01 Last confirmed: 2026-10-02 How our data works → Report this job

Similar opportunities