Jobs / United States / Intel Corporation
Module Engineering PhD Intern Summer 2027
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k. Most were filed at wage level III (52%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Role and Impact In this role, you will contribute to the development and optimization of manufacturing processes for a specific module within semiconductor production. You will work hands-on to sustain and improve manufacturing equipment, troubleshoot issues, and support qualification activities, all while collaborating with engineering teams to achieve production goals. This internship offers a unique opportunity to apply your academic knowledge, gain practical skills, and explore potential career paths in a dynamic and innovative environment. Business group As part of Intel Foundry Services, you will join a team that focuses on diffusion and implantation processes within semiconductor manufacturing. This group is dedicated to advancing technology and achieving excellence in production methodologies. By working collaboratively, the team supports Intel's broader mission of driving innovation and delivering high-quality solutions to meet global technological demands. Key Responsibilities • Support the development and implementation of semiconductor manufacturing processes for a specific module. • Sustain and improve manufacturing equipment performance, ensuring operational efficiency and reliability. • Assist in equipment troubleshooting and qualification activities to meet production standards. • Collaborate with engineering teams to optimize process control methodologies and ensure production targets are achieved. • Apply statistical analysis and design experiments to enhance process reliability and throughput. • Gain hands-on experience in materials and device characterization techniques, such as SEM and TEM. • Contribute to the continuous improvement of process control systems and methodologies. Qualifications: Minimum Qualifications • Ph.D. degree in progress in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related STEM field of study. • Hands-on experience and or knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition techniques. • Familiarity with statistical data analysis and design of experiments methodologies. • Experience in materials and physical device characterization, such as SEM or TEM. Preferred Qualifications • Advanced transistor device structures and architectures including fabrication (Atomic Layer Deposition, Chemical Vapor Deposition, Rapid Thermal Annealing, Ion Implantation, Surface treatments and modification) with in-depth knowledge of semiconductor device physics and process integration. • Technical skills such as scripting languages (i.e., Python, JSL, Perl, TCL), or programming languages (i.e., SQL, C/C++, etc.) and statistical data analysis is a plus. • Semiconductor processing fundamentals (lithography, wet etch, dry etch, chemical and or mechanical polishing, etc.). • Design of experiments and data analysis expertise. • Expertise in Materials and physical device characterization (SEM, TEM, etc.) and fundamentals of semiconductor device testing. • Process control systems, methodologies, sources of variability, and statistics. This internship provides a unique platform for growth, innovation, and collaboration. If you're passionate about advancing semiconductor technology while building hands-on expertise in a supportive environment, we encourage you to apply today. Job Type: Student / Intern Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic i