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Silicon Photonics Wafer Level Packaging Design Engineer (f/m/d)
Microvision INC · 
Ulm · 1mo ago
via Company careers site
• Design and develop wafer level packaging solutions, 2D/2.5D/3D, for advanced silicon photonics platforms • Create and optimise metallisation layouts (e.g. UBM, RDL, Solder, TSVs…
Sponsorship possible ✓ 2 H-1B filings certified since Oct 2025
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