Jobs / United States / Intel Corporation
Sr Staff Substrate Yield Lead
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Intel Corporation is seeking a high-impact Yield Development Engineer to drive yield performance for cutting-edge manufacturing processes within the Substrate Technology and Development (SPTD) organization. In this role, you will own end-to-end yield improvement initiatives, leveraging your expertise in data analysis, defect resolution, and designnd transform the future of technology. Intel's APTM organization is seeking a highly driven and execution-focused EMIB-T Substrate Yield Lead to lead yield performance for next-generation advanced packaging technologies, including EMIB-T (Embedded Multi-die Interconnect Bridge with TSV) , Intel's most advanced platform for heterogeneous integration. This is a high-visibility, high-accountability role with significant responsibility for enabling successful technology development and manufacturing readiness across both Intel Foundry Services (IFS) and Intel Product Groups (IPG) . The ideal candidate is a self-starter who thrives in ambiguous and fast-paced environments, proactively drives issues to closure, and requires minimal supervision. Success in this role requires strong technical depth, urgency in execution, the ability to influence cross-functional teams and suppliers, and a relentless focus on delivering yield and program milestones. Business group The SPTD Yield group is part of Intel Corporation and plays a critical role in driving innovation and delivering high-performance yield solutions that enable advanced semiconductor manufacturing. This team focuses on yield ownership, supplier engagement, and defect resolution, ensuring manufacturing excellence for Intel's cutting-edge technologies. By joining this group, you will collaborate across disciplines to support Intel's broader mission of delivering transformative and impactful technology solutions. Key Responsibilities • Lead process yield ownership, driving root cause analysis (RCA) and corrective actions for yield excursions. • Establish real-time yield monitoring dashboards and actionable performance metrics. • Serve as the primary technical interface with substrate suppliers to drive process accountability, defect reduction, and yield enhancement. • Partner with design and integration teams to optimize design rules and improve yield robustness through DFM and DFY initiatives. • Perform statistical data analysis using tools such as JMP and SQL scripting to identify yield limiters and develop solutions. • Apply advanced analytics or machine learning techniques to improve yield prediction and defect classification. • Collaborate with cross-functional teams to solve complex technical challenges, supporting Intel's high-visibility manufacturing programs. Behavioral traits • Demonstrated success in problem-solving for semiconductor manufacturing yield improvements. • Effective collaboration and communication skills to drive results across multidisciplinary teams. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Minimum Qualifications • Bachelor's degree in Materials Science and Engineering, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Physics, or Chemistry or related field, with 9+ years of experience, OR a Master's degree with 6+ years of experience, OR a PhD with 4+ years of experience • 4+ years of experience in at least 3 of the following areas: • Statistical analysis tools (e.g., JMP) and scripting (e.g., SQL) for data analytics. • Yield analysis methodologies, defect density reduction, and process control.