Jobs / United States / Intel Corporation
ATD Laser Development Engineer
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles78 certified filings for “Software Engineer” (Software Developers) in AZ: $111k–$140k, median $120k. Most were filed at wage level II (59%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity to contribute to the development of cutting-edge processes and equipment that enable Intel to stay at the forefront of innovation. Your work will directly impact the performance, quality, and reliability of Intel's assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry. Through technical expertise and collaboration with cross-functional teams, you will help Intel achieve its mission of delivering world-class packaging solutions. Key Responsibilities - Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies. - Optimize manufacturing processes to meet stringent quality, reliability, cost, yield, productivity, and manufacturability requirements. - Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles. - Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows. - Establish laser process specifications and collaborate with suppliers to meet quality and performance standards. - Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues. - Set laser process reliability requirements based on a strong understanding of failure mechanisms, influencing design, material selection, and process development. - Drive standardization in qualification procedures, manufacturing quality systems, and processes while collaborating with engineering teams to meet critical milestones. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications • Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field • OR Master's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field Relevant experience should include the following: - Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles. - Fundamental understanding of laser and optical systems Preferred Qualifications - Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems. - Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly. - Demonstrated ability to collaborate with cross-functional teams and deliver results in time-sensitive projects. - Capability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets. We invite you to bring your expertise, creativity, and passion for technology innovation to Intel. Join us in driving the future of semiconductor packaging and make a lasting impact on the technology landscape. Apply today. Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical