Jobs / United States / Intel Corporation
Module Engineering PhD Intern New 2027
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k. Most were filed at wage level III (52%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Role and Impact Join Intel as a Module Engineering PhD Intern and contribute to the development of advanced semiconductor manufacturing technologies. In this role, you will work alongside experienced engineers to improve manufacturing processes, optimize equipment performance, and drive operational excellence within a high-volume production environment. This internship provides a unique opportunity to apply research and technical expertise to real-world engineering challenges. Through hands-on projects, data-driven problem solving, and collaboration with cross-functional teams, you will gain practical experience in semiconductor manufacturing while helping develop the technologies that power the future. Business Group Intel Foundry is a leader in semiconductor manufacturing, delivering innovative process technologies that enable next-generation computing solutions. Our teams are dedicated to advancing manufacturing excellence through continuous process improvement, engineering innovation, and operational efficiency. As part of Intel Foundry, you will collaborate with industry-leading engineers and researchers to develop technologies that have a global impact. Key Responsibilities • Support the development, improvement, and implementation of semiconductor manufacturing processes within assigned modules. • Support projects focused on yield improvement, quality enhancement, cost reduction, and operational efficiency. • Analyze process and manufacturing data to identify trends, root causes, and opportunities for improvement. • Collaborate with cross-functional teams to improve process control methodologies and manufacturing performance. • Design and execute experiments to evaluate process modifications and drive continuous improvement initiatives. • Apply technical and analytical expertise to solve complex manufacturing challenges. • Assist in equipment qualification, troubleshooting, maintenance, and process optimization activities. • Document technical findings and communicate recommendations to engineering stakeholders. Qualifications: Minimum Qualifications • Currently pursuing a PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Physics, Applied Chemistry, Computer Science or a related STEM discipline. • Minimum of 3 months of research, laboratory, internship, academic, or industry experience. • Strong academic performance with a cumulative GPA of 3.0 or higher required Preferred Qualifications • Experience with data analysis tools (JMP, Python, MATLAB, Excel). • Knowledge of DOE, statistical analysis, and process optimization. • Understanding of semiconductor manufacturing and process engineering fundamentals. • Programming experience for engineering or scientific applications. • Strong analytical, problem-solving, and data interpretation skills. • Effective communication and teamwork skills. • Ability to work independently in a collaborative environment. • Willingness to work in a semiconductor manufacturing cleanroom. • Strong attention to detail and execution discipline. Be part of shaping the future of semiconductor manufacturing while developing your expertise in a dynamic and supportive environment. Apply today to embark on an exciting career journey. Job Type: Student / Intern Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital statu