Senior / Principal Silicon Photonic Packaging & Process Engineer

Silicon Photonic Packaging & Process Engineer About Voyant Photonics Voyant Photonics, based in the heart of New York City, is transforming machine perception with a new class of LiDAR devices that are compact enough to fit in the palm of your hand and powerful enough to measure range, velocity, and reflectivity with unparalleled accuracy. By leveraging cutting-edge silicon photonic chips smaller than your fingertip, we deliver sensors that are not only revolutionary in performance but also affordable enough to integrate into any system. Our technology disrupts the status quo of bulky, expensive, and power-hungry LiDAR systems, making high-precision sensing accessible for widespread adoption in robotics, autonomous vehicles, drones, industrial automation, and beyond. With Voyant, the next generation of machines can see, understand, and navigate the world like never before. Discover how we’re redefining what’s possible by making real products out of cutting-edge research in silicon photonics. The Opportunity: As a Principal Silicon Photonic Packaging & Process Engineer, you will lead the development and scaling of precision opto-mechanical assembly processes. You will work closely with photonics, mechanical, and test teams to translate design concepts into R&D builds then into repeatable production processes. You will also partner with our contract manufacturers to qualify lines, improve yields, and drive continuous process improvements. This is a unique opportunity to take ownership of critical opto-mechanical and electronic assembly processes that define the precision, yield, and quality of Voyant’s LiDAR modules. You will establish new package designs focused on robust, high-yield manufacturing processes, optimize production at our global contract manufacturers, and help scale complex, high-precision processes from R&D to high-volume production. Your work will directly impact Voyant products, accelerating time-to-market, reducing cost, and ensuring consistent product quality across global manufacturing sites. This position requires willingness to travel up to 25% domestically and internationally, both within the United States and internationally (primarily Europe and Asia), to support process transfer, line qualification, and build execution at our manufacturing partners. Key Responsibilities Package Design: Familiarity with various packaging technologies including organic and ceramic substrates. Wafer level packaging and 2.5D/3D assembly processes as well as those listed below. Identifying and initiating business with substrate suppliers and assembly houses. Working through the design process mechanically, thermally and electrically to create the optimal solution while staying within supplier manufacturing capabilities. Creating CAD models for simulation and performing simulations to verify designs prior to release. Precision Lens Assembly: Own process definition and control for automated microlens alignment and bonding. Program motion sequences, optimize camera and vision-based routines, and tune process parameters (alignment offsets, bonding dwell, UV cure profiles, placement forces) to achieve sub-micron accuracy and high yield. Die Placement Process Ownership: Define and maintain process parameters for high-precision die-attach and placement equipment. Drive correlation between pick-and-place accuracy, epoxy flow, and bond-line thickness for consistent optical coupling. Epoxy and Adhesive Dispense Control: Establish and control parameters for automated dispense systems. Develop dispense recipes controlling needle diameter, pressure, time, temperature, and material conditioning. Characterize cure profiles and shrinkage impacts on optical alignment stability. Yield and DOE Execution: Design and execute stru