Jobs / United States / Renesas Electronics America INC

Renesas Electronics America INC

Sr Staff Engineer, Product Marketing

San Jose, CALIFORNIA, US Posted today

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 56 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Renesas Electronics America INC paid sponsored hires in similar roles1 certified filing for “Principal Product Marketing Specialist (Sales Engineer)” (Sales Engineers) in CA: $255k–$255k, median $255k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 56 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Renesas Electronics America INC paid sponsored hires in similar roles
1 certified filing for “Principal Product Marketing Specialist (Sales Engineer)” (Sales Engineers) in CA: $255k–$255k, median $255k. Most were filed at wage level III (100%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

This senior role combines datacenter server-system expertise with product definition and marketing for MCU-based platform-management and control-plane solutions. The candidate will understand how server motherboards, CPU and GPU/AI accelerator trays, storage backplanes, power systems, and cooling subsystems are monitored and controlled. The focus is distributed management controllers, satellite controllers, and board-management MCUs that work alongside the baseboard management controller (BMC), rather than a replacement for the BMC itself. Working with hyperscalers, server OEMs, ODMs, and ecosystem partners, the candidate will translate system requirements into differentiated silicon, firmware, reference solutions, business cases, roadmaps, and go-to-market plans.  • Bachelor’s degree or higher in electrical engineering, computer engineering, computer science, or related field with 8+ years of relevant experience.   • Experience in system architecture, server platform management, embedded systems, semiconductor product definition, technical product management, or applications engineering.  • Strong system knowledge of server motherboards, CPU/GPU/AI accelerator platforms, storage backplanes, and power and cooling subsystems, including their management interfaces and controller partitioning.  • Strong understanding of BMC-based out-of-band management, satellite management controllers, MCU/RTOS firmware, and the boundary between local real-time control and system-level management.  • Working knowledge of MCTP transport, PLDM-based monitoring/control and firmware update, SPDM authentication and measurement exchange, and how device management integrates with BMC-hosted Redfish services.  • Familiarity with server sideband interfaces such as I2C/SMBus, I3C, SPI, UART, GPIO, and PMBus, and their implications for connectivity, latency, reliability, and MCU requirements.  • Ability to create product requirements, business cases, roadmaps, and go-to-market plans.  • Strong communication skills with executive, technical, customer, and cross-functional audiences.    • Preferred:  Experience with hyperscaler or enterprise servers, GPU/AI accelerator trays, rack management, power shelves, fan controllers, or liquid-cooling management.  • Practical exposure to OpenBMC integration, OCP DC-SCM/DC-SCI or modular server architectures, and interoperability testing of MCTP/PLDM/SPDM endpoints.  • Experience defining secure, software-enabled controllers with secure boot, hardware root of trust, device identity, signed firmware updates, recovery, SDKs, and reference designs.  • Experience with server bring-up, power sequencing, telemetry and fault diagnostics, firmware lifecycle management, or customer design-ins involving hyperscalers, OEMs/ODMs, and BMC ecosystem partners.  • Advanced degree in engineering or business, or equivalent senior product strategy experience.                                                                                                                                                                                                                                                                                                     • Product definition:  Define MCU requirements for server platform management, satellite controllers, and distributed control across compute, accelerator, storage, power, and cooling subsystems.  • Translate customer and market input into MRDs, business cases, roadmap proposals, and investment priorities.  • Define use cases for rack-level monitoring and control, board housekeeping, power sequencing, reset control, sensor aggregation, telemetry, thermal management, power capping, fault reporting, and recovery.  • Define the complete solution: silicon, embedded firmware, management-p

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