Jobs / United States / PhiX B.V.

PhiX B.V.

Photonic Packaging Engineer

Bozeman, Montana, United States Posted 1 month ago

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Sponsorship verdict

No sponsorship evidence yet

No government record and no wording either way. Not a refusal: ask the recruiter.

  • No government sponsor record hereThis employer does not appear with approvals in the government data SponsorApply holds.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

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Before you apply

Sponsorship unknown

No register record and no sponsorship wording in the posting. Worth asking the employer before investing significant time.

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About the role

Are you passionate about the cutting-edge field of photonic integrated circuits? Do you thrive on solving complex challenges in electronic and photonic IC packaging? If so, we have an exciting opportunity for you! As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC packaging and assembly processes. Your role will involve leading customer projects, translating their unique requirements into precise assembly designs, and collaborating closely with our engineering team to optimize product designs for manufacturability. This position offers an opportunity to contribute to new advancements in photonic technologies and play a key role in the success of innovative projects. Your primary responsibilities will include • Perform hands-on packaging and assembly of PIC based modules • Translate diverse customer requirements into detailed assembly design • Collaborate closely with design engineers to optimize product designs. • Innovate optical interconnection methods for seamless integration. • Design and refine assembly setups for effective validation and prototyping. • Implement automation techniques to enhance assembly efficiency and ensure scalability.

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