Jobs / United States / Boeing Company

Boeing Company

Electrical & Electronics Design and Analysis Engineer (Lead, Senior or Principal)

USA - Albuquerque, NM Posted today

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Sponsorship verdict

Posting rules out sponsorship

The posting rules out sponsorship or requires citizenship or security clearance.

  • Employer is on a government sponsor recordThe US Department of Labor certified 72 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Boeing Company paid sponsored hires in similar roles11 certified filings for “Mechanical System Design & Analysis Engineer” (Mechanical Engineers) in WA: $135k–$170k, median $143k.
  • Citizenship requirement statedFrom the posting’s own wording.
  • Security clearance mentionedFrom the posting’s own wording.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 72 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Boeing Company paid sponsored hires in similar roles
11 certified filings for “Mechanical System Design & Analysis Engineer” (Mechanical Engineers) in WA: $135k–$170k, median $143k. Most were filed at wage level IV (100%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

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Before you apply

Review before applying

Citizenship requirement stated — the posting’s wording suggests candidates who already hold work rights. Read the original listing carefully.

Requirement gap

The posting mentions a security clearance — usually restricted to citizens of that country.

These come from the posting’s own wording. Read the original listing to confirm. See better-fit alternatives →

About the role

Electrical & Electronics Design and Analysis Engineer (Lead, Senior or Principal) Company: The Boeing Company Boeing Defense, Space and Security (BDS) is seeking a talented Electrical/Electronic Design and Analysis Engineer (Lead, Senior, or Principal) (Level 4, 5, or 6) to join our team in Albuquerque, New Mexico. This role will focus on designing, integrating and testing advanced electrical/electronic concepts on a Department of Defense proprietary program.  The primary responsibility of this individual will be working with a multi-disciplined engineering team to decompose system level requirements to electronic subsystems/components. This position will serve as our lead Electronics Engineer for a team tasked with requirements definition, and design/development/test of new electronic hardware solutions. The ideal candidate will have experience with electronic design (analog and digital); high speed, low latency systems; firmware development, requirements tracking/verification; assembly and test of subsystems; integration of subsystems into the final system; and a passion for finding solutions to solve interesting problems.   Position Responsibilities:    • Derive and document hardware requirements from system-level specifications • Design, develop, and test mixed-signal electronic circuits and systems • Lead the design and implementation of Printed Circuit Board (PCB) layouts and schematics • Collaborate with software and firmware engineers to ensure seamless integration of hardware and software components • Participate and conduct design reviews (i.e. TRR, PDR, and CDR’s) • Perform simulations and analyses to validate design performance • Perform Signal and Power Integrity Analysis on preliminary and final designs • Troubleshoot and resolve hardware issues during development and testing phases • Ability to write Supplier Statement of Works (SSOWS) for board fabrication or other related contractual work   This position is expected to be 100% onsite.  The selected candidate will be required to work onsite at the listed location option.   Basic Qualifications (Required Skills/ Experience): • This position requires an active U.S. Top Secret Security Clearance (U.S. Citizenship Required) (A U.S. Security Clearance that has been active in the past 24 months is considered active) • Ability to obtain access to Sensitive Compartmented Information (SCI) Programs • Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement • 9+ years of related work experience or an equivalent combination of education and experience    Preferred Qualifications (Desired Skills/Experience): • Senior (Level 5): 14+ years of related work experience or an equivalent combination of education and experience  • Principal (Level 6): 20+ years of related work experience or an equivalent combination of education and experience • 9+ years of experience with the design, development, and integration of complex electronic systems or subsystems • 9+ years of experience with analog and/or digital circuit design, packaging techniques, and/or power systems • Experience developing subsystem electrical/electronic requirements • Experience providing mentorship and guidance for designs made by early/mid-career electrical/electronic engineers • Experience with high speed, low latency electronic design • Experience with firmware development • Knowledge of relevant MIL ( MIL-STD-461G, MIL-STD-464, etc. ), IPC ( IPC-6012, IPC-6013, IPC-A-620 ) and assembly (J-STD-001) standards   Conflict of Interest: Successful candidates for this job must satisfy the Company’s Conflict of In

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