Jobs / United States / Renesas Electronics America INC

Renesas Electronics America INC

Senior Director, Hardware Engineering

San Jose, CALIFORNIA, US Posted today

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Skills this job asks for

LeadershipProduct managementLLMsMachine learning

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 56 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Renesas Electronics America INC paid sponsored hires in similar roles2 certified filings for “Manager, Software Engineering” (Architectural and Engineering Managers) in CA: $210k–$339k, median $274k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 56 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Renesas Electronics America INC paid sponsored hires in similar roles
2 certified filings for “Manager, Software Engineering” (Architectural and Engineering Managers) in CA: $210k–$339k, median $274k. Most were filed at wage level IV (100%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

The Senior Director, Central Engineering will lead the development of advanced SoC architecture, modeling methodologies, and design enablement strategies across multiple product lines. This role is responsible for establishing scalable design and verification methodologies, driving SystemC and SystemVerilog model development, and leveraging AI-driven techniques to improve productivity, quality, and time-to-market for complex semiconductor SoCs.   The ideal candidate is a recognized technical leader with deep expertise in SoC architecture, system modeling, RTL development, and engineering process transformation. They will partner with product groups, platform teams, and executive leadership to define and deploy next-generation design methodologies that accelerate innovation and enable reuse across the organization. Key Responsibilities Technical Leadership • Define and drive the strategic roadmap for SoC design methodologies across the company. • Lead architecture reviews and technical direction for complex SoC and subsystem developments. • Establish best practices for hardware/software co-design and model-based development. • Provide technical leadership for cross-functional teams spanning architecture, design, verification, emulation, and software. System Modeling & Virtual Platforms • Lead development of transaction-level and architectural models using SystemC/TLM . • Define methodologies for building executable SoC specifications and virtual platforms. • Drive alignment between SystemC models, RTL implementations, and software development environments. • Enable early software development and system validation using virtual prototypes. Design & Verification Methodology • Develop and standardize SoC modeling and verification flows using SystemVerilog , UVM, and related methodologies. • Promote reusable IP, subsystem, and SoC-level modeling frameworks. • Drive methodology adoption across product groups to improve predictability, quality, and reuse. • Establish metrics and KPIs to measure design productivity and model accuracy. AI-Driven Engineering Innovation • Define and implement AI-enabled methodologies for model generation, verification, and validation. • Evaluate and deploy Generative AI, LLMs, and automation technologies to improve engineering efficiency. • Create workflows that leverage AI for: • SystemC model generation • SystemVerilog model development • Verification content generation • Coverage analysis • Design documentation • Requirement traceability • Lead pilot programs and organization-wide adoption of AI-assisted design methodologies. Organizational Leadership • Build and lead high-performing engineering teams. • Mentor directors, principal engineers, and distinguished engineers. • Foster collaboration across Central Engineering, Product Groups, and external partners. • Influence long-term semiconductor technology and platform strategy. Education • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical discipline. • Master's degree or Ph.D. preferred. Experience • 15+ years of experience in semiconductor or SoC development. • 8+ years of technical leadership experience managing large engineering organizations and complex programs. • Proven experience leading SoC architecture, design, or verification teams. Technical Skills • Strong understanding of: • SoC architecture and integration • Digital design methodologies • IP and subsystem development • Hardware/software co-design • SoC verification methodologies • Hands-on experience with: • SystemC/TLM model development • SystemVerilog and UVM-based verification environments • Virtual platforms and executable specifications • SoC performance modeling • Design and verific

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