Module Equipment Technician, Night Shift 6

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. This position is part of Intel's Wafer Packaging Manufacturing (WPM) organization, which is dedicated to driving advanced packaging technologies and ensuring high-quality semiconductor production. WPM plays a vital role in Intel's mission to deliver world-class innovations by maintaining industry-leading manufacturing standards and supporting groundbreaking technologies.   We are seeking a Module Equipment Technician, Night Shift 6 to join our night shift team in Hillsboro, Oregon. In this role, you will maintain and optimize the performance of critical semiconductor manufacturing and wafer packaging equipment. You will perform electrical and mechanical troubleshooting, repairs, preventative maintenance, and tool calibrations to support Intel's ability to meet rigorous quality and production targets. This role offers an exceptional entry point into semiconductor equipment engineering, providing continuous hands-on learning alongside world-class technical experts.   Shift Information Shift 6: 7:00 PM – 7:30 AM on an alternating weekly schedule: Wed-Sat and alternating Saturday night   Key Responsibilities: • Electromechanical Troubleshooting: Perform detailed electrical and mechanical troubleshooting to diagnose, isolate, and resolve issues in high-tech manufacturing equipment. • Tool Maintenance & Repair: Dismantle, adjust, repair, and reassemble complex semiconductor tools using layout plans, blueprints, repair manuals, and technical drawings. • Equipment Calibration: Execute equipment setup, precision calibrations, and routine preventative maintenance to ensure optimal tool performance and uptime. • Engineering Collaboration: Partner with Module Engineering to conduct experiments, implement hardware/software configuration changes, and support cleanroom data collection activities. • Documentation & Continuous Improvement: Monitor, analyze, and document tool performance data to identify improvement areas; update specifications and technical documentation to enhance system reliability. • Factory Ramp Support: Assist with WPM factory ramp efforts, ensuring equipment is installed, configured, or converted per design specifications.   As a Successful Candidate, You Will Bring: • Strong Problem-Solving & Analytical Thinking: Natural troubleshooting mindset with the focus required to diagnose complex, multi-variable electrical and mechanical issues. • Collaboration & Teamwork: Actively contributes to a high-performing shift culture, working seamlessly alongside engineering, operations, and external suppliers. • Attention to Detail: Meticulous approach to executing tasks within defined specifications, maintaining documentation, and adhering to strict cleanroom protocols. • Safety-First Mindset: Uncompromising commitment to maintaining a safe, clean, and compliant working environment.   Apply today to join Intel Oregon's Wafer Packaging Manufacturing team. Take ownership of cutting-edge technology, work with an industry-leading team, and build a rewarding technical career.   Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. This Position is not eligible for Intel immigration sponsorship. Minimum Qualifications: An applicant must meet at least one of the following criteria: • An Associate of Science degree in a STEM-related field (e.g., Microelectronics, Manufacturing T