NM Wafer Packaging Manufacturing: Advanced Packaging Module Engineer

Job Details: Job Description: The Role and Impact Note: This position requires regular onsite presence to perform essential job responsibilities. New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding, and we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will support both high-volume manufacturing (HVM) and technology development activities, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services (IFS) technologies. Key Responsibilities Responsibilities include, but are not limited to: • Drive sustained operational excellence by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, and initiatives that enhance equipment availability, utilization, and cost efficiency. • Collaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and drive continuous improvements in processes and equipment performance. • Develop and execute technology roadmaps to achieve process requirements, business objectives, and key milestones. • Install, qualify, and ramp equipment and manufacturing processes to support new product introductions and production start-up milestones. • Lead efforts to resolve complex technical challenges and implement robust systems that prevent recurrence. • Support and sustain development and pilot production lines during early test vehicle and production phases. • Partner closely with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments. • Evaluate, qualify, and implement new hardware, software, and equipment upgrades. • Lead critical task forces and cross-functional initiatives related to areas of ownership and adjacent manufacturing processes. Desired Behavioral Traits The successful candidate will demonstrate: • A strong commitment to safety and a proactive approach to promoting a safe work environment. • The ability to thrive in a dynamic environment with evolving priorities and technical challenges. • A results-oriented mindset with strong organizational skills, initiative, resourcefulness, and accountability. • Excellent analytical and problem-solving skills, with a strong sense of urgency and commitment to achieving business objectives. • The ability to distill complex technical concepts into clear, actionable communication for stakeholders at all organizational levels. • Proven success working within high-performing teams, including demonstrated leadership, collaboration, prioritization, and problem-solving capabilities. • A continuous improvement mindset, with experience applying Lean principles and methodologies to drive operational and manufacturing excellence. • Qualifications: Minimum Qualifications • Bachelor's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related technical field. • Completed academic coursework, laboratory work, or technical projects in semiconductor technologies, electronics, or mechanical engineering.   Preferred Qualifications • 2+ years of relevant experience with a Bachelor's degree, or no prior experience required with a Master's degree. • Familiarity with semiconductor manufacturing process flows, with an emphasis on advanced packaging technologies. • Hands-on experience with semiconductor manufacturing equipment, including tool matching, calibration, and performance optimization. • Demonstrated success in tool installation, qualification, and production readiness activities. • Working knowledge of Design of Experiments (DOE) methodologies and their application to t