Jobs / United States / Intel Corporation
Substrate Quality and Reliability Engineer
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles11 certified filings for “Quality Reliability Engineer” (Industrial Engineers) in AZ: $103k–$130k, median $117k. Most were filed at wage level II (50%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. As a Substrate Quality and Reliability Engineer you will drive substrate capacity expansion to influence key technology decisions for Intel package and assembly in TD and ramp phases. You will also be responsible to enable qual plans and strategies to meet product milestones and assess key risks to technology development activities at a component level and address product manufacturing challenges at substrate factories for future HVM stability. You will influence supplier process technologies and their interaction with assembly as well as substrate package induced customer facing issues and their validation. Role and Responsibilities include but are not limited to: - Develop, apply, and maintain quality and reliability standards for Substrate packaging components for Test Vehicle and Product. - Develop the integrated materials/process and technology targets to meet the requirements of product use case requirements and demonstrate maturity milestones. - Define inspection, screening, and testing mechanism to mitigate yield and reliability risks. - Determine reliability requirements to achieve reliability objectives. - Develop reliability models by performing statistical analysis to more accurately categorize reliability risk to customer specification and field risk. - Deliver standardization in product qualification, manufacturing quality systems, and methods. - Influence, enable, and continuously engage with packaging technology development and partner engineering teams on process maturity to lower risks. - Develop new acceleration techniques, analytical tools, and quality screens to ensure the early identification of potential problems with every new technology and process. - Respond to customer requests or quality events as they occur - Make proactive recommendations for changes in specification or formulation to improve product quality and reliability. The ideal candidate should exhibit the following behavioral traits: - Influence cross-functional teams and solve complex technical challenges and deliver robust solutions. - Thrive in ambiguous environment and competing priorities and provide technical and analytical problem solving. Qualifications: Minimum Qualifications: - Master's degree with 2+ years of industry experience OR PhD degree in Materials Science, Electrical Engineering, Physics, Chemistry, Mechanical Engineering, Aerospace Engineering, Chemical Engineering, or a related engineering discipline. - 2+ years of experience in at least one of the following areas: substrate manufacturing, semiconductor fabrication, package assembly, wafer-level processing, or board/system integration. - Demonstrated ability to collaborate across cross-functional teams. Preferred Qualifications: - 1+ years of experience in empirical data collection and statistical data analysis, reliability statistics, and design of experiments. - Technical background in any of the below mentioned areas of substrate or semiconductor or Intel package technology with proficiency in one or more areas of manufacturing process development, material characterization, and development design validation. - Technical understanding of capacitor, inductor, resistor passive component manufacturing process, functionality and testing procedures. - Technical understanding of active component fabrication, functionality and testing procedures. - Technical understanding of Intel's product certification methodology and integrated package risks with knowledge of modulators and controls. - Technical understanding of accelerated life testing methods and reliability statistics. - Programming or scripting experience for data analysis, such as Python or SQ