Jobs / United States / Intel Corporation
Advanced Packaging Process Integration Engineer
Intel Corporation · 🇺🇸 2 Locations
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Role and Impact As a Process Integration and Yield Engineer, you will play a pivotal role in driving process optimization and innovation to ensure high-yield performance in advanced packaging technologies. You will oversee day-to-day integration of processes across various toolsets, analyze data to identify trends, and implement solutions to enhance yields and minimize defects. Your work will directly impact Intel's ability to deliver leading-edge semiconductor products efficiently and with exceptional quality. Business group Intel Corporation is at the forefront of innovation, delivering world-class semiconductor technologies that power countless devices worldwide. This role is part of NM Advanced Packaging, which focuses on developing cutting-edge packaging solutions to meet the ever-evolving demands of modern computing. The team contributes to Intel's mission of enabling transformative computing experiences by ensuring robust designs, optimized processes, and scalable manufacturing solutions. Key Responsibilities - Collaborate with cross-functional teams to develop and refine process integration strategies for advanced packaging technologies. - Monitor and analyze yield performance, identifying root causes of variability and implementing corrective actions to improve production outcomes. - Develop and maintain process control systems to ensure consistency and reliability across manufacturing operations. - Design experiments and analyze data from test runs to drive process enhancements and address technical challenges. - Contribute to continuous improvement efforts by identifying opportunities to optimize workflows and reduce cycle times. - Support new technology introduction and ramp-up by integrating novel processes into production environments. Qualifications: Minimum Qualifications - Bachelor's degree in a relevant field such as Materials Science, Chemical Engineering, or Electrical Engineering, with 4+ years of hands-on experience in process integration within semiconductor manufacturing OR Master's degree in a relevant field with 3+ years of domain-related experience OR PhD in a relevant field with no prior professional experience. - Demonstrated expertise in statistical process control methodologies and yield analysis. - Proficiency in data analysis using tools such as Python, MATLAB, or statistical software. - Experience with advanced packaging technologies or semiconductor manufacturing processes. - Knowledge of experimental design and failure analysis techniques. Preferred Qualifications - Strong communication skills and ability to collaborate effectively across diverse teams and functions. - Proven track record of solving complex technical challenges and driving innovative solutions. - Familiarity with project management principles and ability to prioritize tasks in fast-paced environments. - Passion for learning and staying updated on industry trends and advancements in semiconductor packaging technologies. Take the next step in your career by joining Intel, where you can make a tangible impact on cutting-edge technologies and contribute to shaping the future of computing. Job Type: Experienced Hire Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Malaysia, Kulim Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Wo