Jobs / United States / Intel Corporation

Intel Corporation

Module Engineering - PhD Intern (Wet Etch)

US, Oregon, Hillsboro Posted today $120,898

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LeadershipStatisticsComplianceCommunicationPythonExcel

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Intel Corporation paid sponsored hires in similar roles50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Intel Corporation paid sponsored hires in similar roles
50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k. Most were filed at wage level III (52%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. The pay stated here ($120,898.00-120,902.00 USD) is below what this employer usually pays sponsored hires for this role. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

Job Details: Job Description: The Role and Impact Join us as a Module Engineering PhD Intern, where you will work hands-on to support the development, optimization, and implementation of cutting-edge semiconductor manufacturing processes. In this role, you will contribute directly to advancing Intel's technology by collaborating on experiments, analyzing data, and identifying innovative solutions to engineering challenges. Your daily work will play a key role in driving efficiency, quality, and innovation for Intel's manufacturing operations. Business group The Intel Foundry team is dedicated to delivering groundbreaking semiconductor solutions that empower innovation across industries and enable a smarter, more connected future. As part of the Wet Etch group, you will work within a team focused on process engineering for advanced manufacturing technologies. The team's mission is to ensure Intel's leadership in semiconductor fabrication by driving excellence in process design, execution, and continuous improvement to support Intel's broader technology goals. Key Responsibilities • Collaborate with engineering teams to design, execute, and analyze process experiments to optimize Wet Etch module performance. • Utilize statistical analysis and data interpretation methods to identify opportunities for process improvements. • Contribute to the evaluation and implementation of novel manufacturing techniques and technologies. • Support ongoing process documentation, ensuring accuracy and compliance with industry standards. • Troubleshoot engineering issues and provide innovative recommendations to enhance module performance. • Work cross-functionally with technical teams to ensure alignment with broader manufacturing objectives. Qualifications: Minimum Qualifications • Currently pursuing a PhD degree in a relevant STEM discipline (e.g. Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, Computer Science, Data Science, etc.). • Strong analytical and problem-solving skills. • Experience writing software code for application in above majors • Excellent communication skills - both written and verbal. • Ability to work independently and as part of a diverse, high-performing team. • Willingness to work in a cleanroom environment. • Strong attention to detail and disciplined approach to procedures. • Data analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment. Preferred Qualifications • Experience with data analysis tools and software (e.g. JMP, Python, Excel). • Ability to summarize data for technical and non-technical audiences. • GPA 3.5 or higher preferred. • Experience working in a Semiconductor fabrication and or Wet Etch environment Bring your passion for engineering excellence and innovation to Intel and contribute to shaping the future of technology. Join us on this exciting journey and accelerate your career development while making an impact.            Job Type: Student / Intern Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs

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